[RTF] Reverse Treated ED Copper Foil
![[RTF] Reverse Treated ED Copper Foil Featured Image](https://cdn.globalso.com/civen-inc/RTF-Reverse-Treated-ED-Copper-Foil.png)
Khoom Taw Qhia
RTF, thim rov qab kho electrolytic tooj liab ntawv ci yog cov ntawv ci tooj liab uas tau roughened mus rau qhov sib txawv ntawm ob sab.Qhov no ntxiv dag zog rau tev lub zog ntawm ob sab ntawm cov ntawv ci tooj liab, ua rau nws yooj yim dua los siv ua cov txheej txheem nruab nrab rau kev sib txuas rau lwm cov ntaub ntawv.Ntxiv mus, qhov sib txawv ntawm kev kho mob ntawm ob sab ntawm cov ntawv ci tooj liab ua rau nws yooj yim rau etch lub thinner sab ntawm roughened txheej.Nyob rau hauv tus txheej txheem ntawm kev ua ib tug luam Circuit Court board (PCB) vaj huam sib luag, kho sab ntawm cov tooj liab yog siv rau cov khoom siv dielectric.Sab nruas kho yog rougher dua lwm sab, uas yog ib tug ntau adhesion rau lub dielectric.Qhov no yog lub ntsiab kom zoo dua tus qauv electrolytic tooj liab.Sab matte tsis xav tau kev kho tshuab lossis tshuaj lom neeg ua ntej siv photoresist.Nws yog twb ntxhib txaus kom muaj zoo laminating tiv thaiv adhesion.
Specifications
CIVEN tuaj yeem muab RTF electrolytic tooj liab ntawv ci nrog nominal thickness ntawm 12 txog 35µm txog 1295mm dav.
Kev ua tau zoo
Qhov kub kub elongation thim rov qab kho electrolytic tooj liab ntawv ci yog raug rau cov txheej txheem plating meej los tswj qhov loj ntawm cov qog tooj liab thiab faib lawv sib npaug.Qhov rov qab kho qhov kaj ntawm daim ntawv tooj liab tuaj yeem txo qhov roughness ntawm cov ntawv ci tooj liab nias ua ke thiab muab lub zog tev ntawm cov ntawv ci tooj liab txaus.(Saib daim duab 1)
Daim ntawv thov
Nws tuaj yeem siv rau cov khoom siv ntau zaus thiab cov laminates sab hauv, xws li 5G hauv paus chaw nres tsheb thiab tsheb radar thiab lwm yam khoom siv.
Qhov zoo
Kev sib txuas zoo zog, ncaj qha ntau txheej lamination, thiab kev ua haujlwm zoo etching.Nws kuj txo cov peev xwm rau luv luv Circuit Court thiab ua rau lub sijhawm ua haujlwm luv.
Table 1. Kev ua tau zoo
| Kev faib tawm | Chav tsev | 1/3 ZOS (12 m²) | 1/2 ZOS (18 m²) | 1 ZPO (35 m²) | |
| Cov ntsiab lus | % | min.99.8 ua | |||
| Qhov hnyav ntawm cheeb tsam | g / m2 | 107 ± 3 | 153 ± 5 | 283 ± 5 | |
| Tensile zog | RT (25 ℃) | Kg / hli2 | min.28.0 Nws | ||
| HT (180 ℃) | min.15.0 Nws | min.15.0 Nws | min.18.0 Nws | ||
| Elongation | RT (25 ℃) | % | min.5.0 | min.6.0 | min.8.0 ib |
| HT (180 ℃) | min.6.0 | ||||
| Roughness | Shiny (Ra) | ib m | max.0.6/4.0 | max.0.7 / 5.0 | max.0.8 / 6.0 |
| Matte (Rz) | max.0.6/4.0 | max.0.7 / 5.0 | max.0.8 / 6.0 | ||
| Peel zog | RT (23 ℃) | Kg / cm | min.1.1 | min.1.2 | min.1.5 |
| Degraded tus nqi ntawm HCΦ (18% -1hr / 25 ℃) | % | max.5.0 | |||
| Hloov xim (E-1.0hr / 190 ℃) | % | Tsis muaj | |||
| Solder Floating 290 ℃ | Sec. | max.20 | |||
| Pinhole | EA | Zero | |||
| Preperg | ---- | FR-4 | |||
Nco tseg:1. Tus nqi Rz ntawm tooj liab ntawv nyiaj tag nrho saum npoo yog qhov ntsuas tus nqi ruaj khov, tsis yog tus nqi lav.
2. Peel zog yog tus qauv FR-4 board kuaj tus nqi (5 nplooj ntawv ntawm 7628PP).
3. Lub sijhawm lav zoo yog 90 hnub txij li hnub tau txais.
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