Cov ntawv ci tooj liab dovua lub luag haujlwm tseem ceeb hauv kev lag luam siab heev xws li cov hluav taws xob hluav taws xob, cov roj teeb tshiab, thiab kev tiv thaiv hluav taws xob. Nws qhov kev ua tau zoo thiab kev ntseeg tau yog txiav txim siab los ntawm qhov tseeb ntawm nws cov txheej txheem tsim khoom thiab kev hloov pauv ntawm nws qhov kev hloov kho. Tsab xov xwm no tshawb nrhiav tag nrho cov kev tsim khoom ntawm dovntawv ci tooj liablos ntawm kev xam pom ntawm kev tshaj lij thiab piav qhia txog nws lub hwj chim rau cov lag luam niaj hnub no los ntawm kev daws teeb meem uas tsim tshwj xeeb rau koj.
I. Cov Txheej Txheem Tsim Khoom Txheem: Kev Sib Npaug ntawm Kev Tseeb thiab Kev Ua Haujlwm Zoo
1. Kev Ua Tooj Liab: Qhov Pib ntawm Kev Huv Si thiab Cov Qauv
Siv cov tooj liab electrolytic uas muaj cov khoom huv si (≥99.99%), cov khoom siv no raug yaj hauv lub tshuab nqus tsev thiab muab pov rau hauv cov ingots uas tuab li 100–200 hli. Cov cua txias raug tswj hwm kom nruj kom ntseeg tau tias cov nplej zoo, sib npaug thiab tiv thaiv kom tsis txhob tawg thaum dov tom qab.
2. Kub dov: Kauj ruam thawj zaug hauv kev txo qhov tuab
Cov tooj liab ingots raug kub dov mus rau 5–10 hli ntawm 700–900 ° C siv lub tshuab zeb tig rov qab. Dynamic lubrication txo qhov hnav ntawm lub roller thiab txo cov kev ntxhov siab sab hauv los ntawm kev casting, tso lub hauv paus rau kev dov meej.
3. Kev Ntxuav: Kev Ntxuav thiab Ua Kom Qhov Chaw Qhib
Siv cov kua qaub nitric-sulfuric acid sib xyaw (10–15% concentration) los tshem tawm cov oxidation. Kev kho electro-polishing ces txo qhov roughness ntawm qhov chaw (Ra) kom qis dua 0.2μm, kom ntseeg tau tias cov txiaj ntsig zoo hauv kev dov ntxiv.
4. Kev Dov Uas Tseeb: Ua Tau Qhov Tseeb Qib Micron
Ntau zaus dov txias ua rau cov tooj liab me dua li 0.1–0.2 hli. Nrog cov tshuab mills uas muaj zog heev thiab cov laser thickness gauges (±2μm accuracy), qhov sib txawv ntawm cov tuab yog khaws cia rau hauv 1%. Lub zog dov thiab qhov nruj raug tswj kom zoo kom tiv thaiv kev tawg ntawm ntug.
5. Kev Dov Ntawv Nyiaj: Tsim Cov Nto Uas Nyias Heev
Cov tshuab ua ntawv ci siab heev siv kev kho qhov sib txawv me me thiab kev siv roj-zaus roj kom ua tiav qhov tuab ntawm 9–90μm. Qhov chaw tiav tshaj ISO 1302 qib 12, tsim nyog rau 5G cov ntawv thov cuam tshuam ntawm daim tawv nqaij.
6. Kev Tshem Tawm Roj: Kauj Ruam Kawg Rau Kev Huv Si Ntawm Qhov Chaw
Kev ntxuav ultrasonic ua ke nrog alkaline degreasing (pH 11–13) tshem tawm cov roj dov seem. Cov pa roj carbon seem raug tswj nyob rau hauv 5mg / m², muab lub hauv paus huv rau kev kho qhov chaw.
7. Kev Txiav thiab Ntim Khoom: Kev Ua Haujlwm Zoo nrog Kev Zoo Nkauj
Cov hniav uas muaj pob zeb diamond coated ua tau qhov dav kam rau ±0.1 hli. Cov khoom raug ntim rau hauv lub tshuab nqus tsev hauv zaj duab xis tiv thaiv kev oxidation thiab khaws cia rau hauv qhov chaw tswj huab cua (25 ± 2 ° C, ≤70% RH) kom ntseeg tau tias kev xa khoom ruaj khov.
II. Kev Ua Haujlwm Tshwj Xeeb: Txhim Kho Kev Ua Haujlwm Tshwj Xeeb rau Kev Lag Luam
1. Kev Ua Kub: Kev Kho Kom Zoo Nkauj Cov Khoom Siv Kho Tshuab
Kub mos (O):Annealed ntawm 400–600°C nyob rau hauv H₂/N₂ huab cua rau 2–4 teev. Lub zog tensile poob rau 200–250MPa thiab elongation nce mus txog 25–40%, zoo tagnrho rau flex circuit dynamic bending.
Kub tawv (H):Khaws lub zog ua haujlwm tawv (400–500MPa), ua kom muaj kev ruaj khov rau IC substrates.
2. Kev Kho Qhov Chaw: Kev Txhim Kho Kev Ua Haujlwm
Kev ntxhib:Kev siv tshuaj lom neeg etching tsim cov nodules 1–2μm, ua rau cov resin lo rau 1.5N/mm lossis ntau dua—daws cov teeb meem delamination hauv 5G boards.
Nickel/Tin Plating:Cov txheej txheej 0.1–0.3μm muab 10 × kev tiv thaiv xeb, tsim nyog rau EV roj teeb tabs.
Txheej Txheem Kub Siab:Zn nano-txheej txheem ua kom cov ntawv ci ruaj khov ntawm 300 ° C, ua haujlwm tau raws li qhov xav tau ntawm kev tsim hluav taws xob hauv aerospace.
III. Txhawb kom Cov Lag Luam Tseem Ceeb muaj zog los ntawm Kev Tsim Kho Tshiab
Khoom Siv Hluav Taws Xob:9μm ntawv ci ua ke nrog kev ntxhib ua rau HDI board kab dav dua 12μm, ua rau lub xov tooj ntse me me.
Cov roj teeb EV:Cov ntawv ci mos mos nrog ≥20% elongation kav ntev dua 3000 pob ntseg khoov, ua kom lub roj teeb ntseeg tau.
Kev tiv thaiv EMI:Cov ntawv ci nickel-plated ua tiav 120dB shielding ntawm 10GHz, zoo tagnrho rau cov chaw khaws ntaub ntawv.
IV. CIVEN METAL: Teem Tus Txheej Txheem Hauv Kev Kho Kom Zoo Nkauj Rau Cov Ntawv Tooj Liab
Ua ib tug thawj coj hauvntawv ci tooj liab dovkev tsim khoom,CIVEN METALtau tsim ib lub tshuab tsim khoom uas yooj ywm uas sib xyaw cov txheej txheem txheem nrog kev hloov kho modular:
Cov chaw ua haujlwm huv si thiab MES tswj tau ± 2μm tuab thiab tiaj tus ≤1I.
Cov cub tawg uas muaj programmable annealing tswj tau txog li 20 qhov kev txiav txim tshwj xeeb tib lub sijhawm.
Lub tsev qiv ntawv "kev kho qhov chaw" tshwj xeeb suav nrog 12 hom kev ntxhib thiab 8 txoj kev xaiv electroplating, nrog rau 72-teev cov voj voog teb.
Kev ua kom cov txheej txheem zoo dua thiab kev nrhiav ntau yam khoom txo cov nqi ntawv ci raws li kev cai los ntawm 15–20% piv rau qhov nruab nrab ntawm kev ua lag luam.
Txij li cov ingots millimeter-scale mus rau micron-thin foil, kev tsim cov ntawv ci tooj liab dov yog kev seev cev ntawm kev tshawb fawb txog khoom siv thiab kev tsim kho qhov tseeb. Raws li 5G thiab kev hloov pauv zog qhib, tsuas yog cov tuam txhab uas muab kev ua haujlwm raug nrog kev hloov kho tob tob tuaj yeem nyob ua ntej.CIVEN METALtab tom tsav qhov kev hloov pauv no, pab Tuam Tshojntawv ci tooj liabkev lag luam nce qib thoob ntiaj teb tus nqi saw.
Lub sijhawm tshaj tawm: Kaum Ib Hlis-19-2025