[HTE] High Elongation ED Copper Foil
![[HTE] High Elongation ED Copper Foil Featured Duab](https://cdn.globalso.com/civen-inc/HTE-High-Elongation-ED-Copper-Foil.png)
Khoom Taw Qhia
HTE, kub kub thiab elongation tooj liab ntawv ci tsim los ntawmCIVEN METALmuaj kev tiv thaiv zoo rau qhov kub thiab txias thiab siab ductility. Cov ntawv ci tooj liab tsis oxidize lossis hloov xim ntawm qhov kub thiab txias, thiab nws cov ductility zoo ua rau nws yooj yim rau laminate nrog lwm cov ntaub ntawv. Cov ntawv ci tooj liab uas ua los ntawm cov txheej txheem electrolysis muaj qhov huv huv heev thiab cov ntawv tiaj tus. Cov ntawv ci tooj liab nws tus kheej yog roughened ntawm ib sab, uas ua rau nws yooj yim rau kev ua raws li lwm cov ntaub ntawv. Tag nrho cov purity ntawm tooj liab ntawv nyiaj yog siab heev, thiab nws muaj zoo heev hluav taws xob thiab thermal conductivity. Txhawm rau ua kom tau raws li qhov xav tau ntawm peb cov neeg siv khoom, peb tuaj yeem muab tsis tau tsuas yog yob ntawm cov ntawv ci tooj liab, tab sis kuj muaj kev pabcuam slicing customized.
Specifications
Thickness: 1.4OZ～20 OZ (9µm～70 µm)
Dav: 550mm～12 95mm
Kev ua tau zoo
Cov khoom lag luam muaj kev ua haujlwm zoo hauv chav tsev kub cia, kub oxidation tsis kam ua haujlwm, khoom zoo kom tau raws li tus qauv IPC-4562Ⅱ, Ⅲqib xav tau.
Daim ntawv thov
Haum rau txhua yam ntawm resin system ntawm ob sab, multilayer luam tawm Circuit Board
Qhov zoo
Cov khoom siv cov txheej txheem kev kho deg tshwj xeeb los txhim kho cov khoom muaj peev xwm tiv thaiv hauv qab corrosion thiab txo qhov kev pheej hmoo ntawm tooj liab residue.
Kev ua tau zoo (GB / T5230-2000, IPC-4562-2000)
| Kev faib tawm | Chav tsev | 1/4 ZOS (9 m) | 1/3 ZOS (12 m²) | J OZ (15μm) | 1/2 ZOS (18 m²) | 1 ZPO (35 m²) | 2 ZPO (70μm) | |
| Cov ntsiab lus | % | ≥99.8 | ||||||
| Qhov hnyav ntawm cheeb tsam | g / m2 | 80 ± 3 | 107 ± 3 | 127 ± 4 | 153 ± 5 | 283 ± 5 | 585 ± 10 | |
| Tensile zog | RT (25 ℃) | Kg / hli2 | ≥ 28 | ≥30 | ||||
| HT (180 ℃) | ≥15 | |||||||
| Elongation | RT (25 ℃) | % | ≥4.0 | ≥5.0 | ≥6.0 | ≥10 | ||
| HT (180 ℃) | ≥4.0 | ≥5.0 | ≥6.0 | |||||
| Roughness | Shiny (Ra) | ib m | ≤0.4 | |||||
| Matte (Rz) | ≤5.0 | ≤ 6.0 | ≤ 7.0 | ≤ 7.0 | ≤ 9.0 | ≤14 | ||
| Peel zog | RT (23 ℃) | Kg / cm | ≥1.0 | ≥1.2 | ≥1.2 | ≥1.3 | ≥1.8 | ≥2.0 |
| Degraded tus nqi ntawm HCΦ (18% -1hr / 25 ℃) | % | ≤5.0 | ||||||
| Hloov xim (E-1.0hr / 190 ℃) | % | Zoo | ||||||
| Solder Floating 290 ℃ | Sec. | ≥ 20 | ||||||
| Pinhole | EA | Zero | ||||||
| Preperg | ---- | FR-4 | ||||||
Nco tseg:1. Tus nqi Rz ntawm tooj liab ntawv nyiaj tag nrho saum npoo yog qhov ntsuas tus nqi ruaj khov, tsis yog tus nqi lav.
2. Peel zog yog tus qauv FR-4 board kuaj tus nqi (5 nplooj ntawv ntawm 7628PP).
3. Lub sijhawm lav zoo yog 90 hnub txij li hnub tau txais.
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