Tin Plated Copper Ntawv Nyiaj
Khoom Taw Qhia
Cov khoom siv tooj liab nthuav tawm hauv huab cua yog nquagoxidationthiab tsim cov tooj liab carbonate, uas muaj kev tiv thaiv siab, tsis zoo hluav taws xob conductivity thiab hluav taws xob tsis zoo; Tom qab tin plating, tooj liab cov khoom tsim cov tin dioxide zaj duab xis nyob rau hauv cov huab cua vim cov khoom ntawm tin hlau nws tus kheej los tiv thaiv oxidation ntxiv.
Khoom siv hauv paus
●High-precision Rolled Copper Foil, Cu (JIS: C1100 / ASTM: C11000) cov ntsiab lus ntau dua 99.96%
Base Material Thickness Range
●0.035mm ~ 0.15mm (0.0013 ~ 0.0059 nti)
Cov khoom siv dav dav
●≤300mm (≤11.8 nti)
Base Khoom Temper
●Raws li cov neeg siv khoom xav tau
Daim ntawv thov
●Cov khoom siv hluav taws xob thiab khoom siv hluav taws xob, kev lag luam pej xeem (xws li: ntim dej haus thiab cov cuab yeej tiv tauj zaub mov);
Performance Parameters
| Cov khoom | Weldable Tin Plating | Tsis-weld Tin Plating |
| Dav Ntau | ≤600mm (≤23.62 nti) | |
| Thickness Ntau | 0.012 ~ 0.15mm (0.00047 nti ~ 0.0059 nti) | |
| Tin txheej Thickness | ≥0.3µm | ≥0.2µm |
| Tin Cov ntsiab lus ntawm Tin Txheej | 65 ~ 92% (Yuav kho cov ntsiab lus tin raws li cov neeg siv khoom vuam txheej txheem) | 100% Pure Tin |
| Surface Resistance ntawm Tin Txheej(Ω) | 0.3 ~ 0.5 hli | 0.1 ~ 0.15 hli |
| Adhesion | 5B | |
| Tensile zog | Base Material Performance Attenuation tom qab plating ≤10% | |
| Elongation | Base Material Performance Attenuation tom qab plating ≤6% | |
