Electrodeposited (ED)ntawv ci tooj liabyog lub hauv paus tsis pom ntawm cov khoom siv hluav taws xob niaj hnub no. Nws cov qauv nyias nyias, kev ywj pheej siab, thiab kev coj ua zoo heev ua rau nws tseem ceeb hauv cov roj teeb lithium, PCBs, thiab cov khoom siv hluav taws xob yooj ywm. Tsis zoo lintawv ci tooj liab dov, uas vam khom rau kev hloov pauv tshuab,ED tooj liab ntawv ciyog tsim los ntawm kev siv hluav taws xob electrochemical, ua tiav kev tswj hwm qib atomic thiab kev hloov kho kom haum rau kev ua haujlwm. Tsab xov xwm no qhia txog qhov tseeb tom qab nws cov khoom tsim tawm thiab cov txheej txheem kev tsim kho tshiab hloov pauv kev lag luam li cas.
I. Kev Tsim Khoom Txheem: Kev Ua Kom Tseeb hauv Kev Tsim Khoom Siv Hluav Taws Xob
1. Kev Npaj Electrolyte: Ib Daim Ntawv Qhia Nano-Optimized
Cov electrolyte hauv paus muaj cov tooj liab sulfate uas muaj cov khoom ntshiab siab (80–120g/L Cu²⁺) thiab sulfuric acid (80–150g/L H₂SO₄), nrog rau gelatin thiab thiourea ntxiv rau ntawm ppm. Cov txheej txheem DCS siab heev tswj hwm qhov kub (45–55°C), tus nqi ntws (10–15 m³/h), thiab pH (0.8–1.5) nrog kev raug. Cov khoom ntxiv adsorb rau cathode los coj cov noob nano-level thiab tiv thaiv qhov tsis zoo.
2. Kev Tso Ntawv Nyiaj: Kev Ua Haujlwm Zoo ntawm Atomic
Hauv cov hlwb electrolytic nrog titanium cathode yob (Ra ≤ 0.1μm) thiab cov hlau lead alloy anodes, 3000–5000 A/m² DC tam sim no tsav cov tooj liab ion deposition ntawm qhov chaw cathode hauv (220) kev taw qhia. Cov ntawv ci tuab (6–70μm) raug kho kom raug ntawm kev ceev yob (5–20 m/min) thiab kev hloov kho tam sim no, ua tiav ± 3% kev tswj tuab. Cov ntawv ci nyias tshaj plaws tuaj yeem ncav cuag 4μm—1/20th qhov tuab ntawm cov plaub hau tib neeg.
3. Ntxuav: Siv Dej Ntshiab Ntxuav Cov Chaw
Lub tshuab ntxuav rov qab peb theem tshem tawm tag nrho cov seem: Theem 1 siv dej ntshiab (≤5μS/cm), Theem 2 siv cov nthwv dej ultrasonic (40kHz) los tshem tawm cov organic, thiab Theem 3 siv cua sov (80–100°C) rau kev ziab kom tsis muaj qhov chaw. Qhov no ua rauntawv ci tooj liabnrog cov pa oxygen <100ppm thiab cov sulfur residues <0.5μg/cm².
4. Kev Txiav thiab Ntim Khoom: Kev Ua Kom Tiav Mus Txog Qhov Kawg Micron
Cov tshuab txiav ceev ceev nrog kev tswj ntug laser ua kom qhov dav dav tsis pub dhau ±0.05 hli. Cov ntim khoom nqus tsev uas tiv thaiv kev oxidation nrog cov ntsuas av noo khaws cia qhov zoo ntawm qhov chaw thaum thauj thiab khaws cia.
II. Kev Kho Kom Zoo Nkauj Rau Qhov Chaw: Qhib Kev Ua Haujlwm Tshwj Xeeb Rau Kev Lag Luam
1. Kev Kho Mob Roughening: Micro-Anchoring rau Kev Sib Txuas Zoo Dua
Kev Kho Mob Pob Txha:Kev plating pulse hauv CuSO₄-H₂SO₄-As₂O₃ tsim cov nodules 2–5μm ntawm qhov chaw ntawm cov ntawv ci, txhim kho lub zog lo rau 1.8–2.5N/mm—zoo tagnrho rau 5G circuit boards.
Kev Nyuaj Siab Ob Chav:Cov khoom me me thiab nano-scale tooj liab ua rau thaj chaw ntawm cov khoom nce ntxiv 300%, txhim kho kev nplaum ntawm cov slurry hauv cov roj teeb lithium anodes los ntawm 40%.
2. Kev Ua Haujlwm Plating: Molecular-Scale Armor rau Durability
Kev Sib Tov Zinc/Tin:Ib txheej hlau 0.1–0.3μm txuas ntxiv kev tiv thaiv ntsev los ntawm 4 mus rau 240 teev, ua rau nws yog qhov siv tau rau cov roj teeb EV.
Txheej Txheem Nickel-Cobalt Alloy:Cov txheej nano-grain uas muaj pulse-plated (≤50nm) ua tiav qhov nyuaj HV350, txhawb nqa cov khoom siv uas khoov tau rau cov xov tooj ntse uas khoov tau.
3. Kev Tiv Thaiv Kub Siab: Dim Ntawm Qhov Kub Heev
Cov txheej txheej Sol-gel SiO₂-Al₂O₃ (100–200nm) pab cov ntawv ci tiv taus kev oxidation ntawm 400°C (oxidation <1mg/cm²), ua rau nws zoo meej rau cov kab ke hluav taws xob hauv aerospace.
III. Txhawb Peb Txoj Kev Lag Luam Tseem Ceeb
1. Cov Roj Teeb Tshiab
CIVEN METAL cov ntawv ci 3.5μm (≥200MPa tensile, ≥3% elongation) ua rau lub zog ntawm lub roj teeb 18650 nce 15%. Cov ntawv ci perforated tshwj xeeb (30–50% porosity) pab tiv thaiv kev tsim lithium dendrite hauv cov roj teeb solid-state.
2. Cov PCBs siab heev
Cov ntawv ci qis-profile (LP) nrog Rz ≤1.5μm txo qhov poob ntawm lub teeb liab hauv 5G millimeter-wave boards los ntawm 20%. Cov ntawv ci qis-profile (VLP) nrog kev kho rov qab (RTF) txhawb nqa cov nqi ntaub ntawv ntawm 100Gb / s.
3. Cov Khoom Siv Hluav Taws Xob Uas Muaj Peev Xwm Hloov Tau
AnnealedED tooj liab ntawv ci(≥20% elongation) laminated nrog PI zaj duab xis tiv taus ntau dua 200,000 khoov (1 hli radius), ua haujlwm ua "pob txha yooj ywm" ntawm cov khoom hnav.
IV. CIVEN METAL: Tus Thawj Coj Kev Kho Kom Haum Rau ED Copper Foil
Ua lub zog ntsiag to hauv ED tooj liab ntawv ci,CIVEN METALtau tsim ib lub tshuab tsim khoom agile, modular:
Tsev Qiv Ntawv Nano-Additive:Muaj ntau tshaj 200 yam khoom sib xyaw ua ke uas tsim los rau lub zog tensile siab, elongation, thiab thermal stability.
Kev Tsim Khoom Siv AI-Guided Foil:Cov kev ntsuas AI-optimized ua kom ntseeg tau tias qhov tseeb ntawm ± 1.5% ntawm qhov tuab thiab ≤2I qhov tiaj tiaj.
Chaw Kho Mob Nto:12 kab tshwj xeeb muab 20+ txoj kev xaiv uas koj tuaj yeem hloov kho tau (roughening, plating, coatings).
Kev Tsim Kho Tshiab Txog Tus Nqi:Kev rov qab siv cov khib nyiab hauv kab ua rau kev siv tooj liab nyoos nce mus txog 99.8%, txo cov nqi ntawv ci kev cai los ntawm 10–15% qis dua qhov nruab nrab ntawm kev ua lag luam.
Txij li kev tswj hwm atomic lattice mus rau kev kho kom zoo dua qub ntawm macro,ED tooj liab ntawv cisawv cev rau lub caij nyoog tshiab ntawm kev tsim khoom siv. Raws li kev hloov pauv thoob ntiaj teb mus rau kev siv hluav taws xob thiab cov khoom siv ntse nrawm dua,CIVEN METALua tus thawj coj nrog nws tus qauv "atomic precision + application innovation" - thawb Tuam Tshoj txoj kev tsim khoom siab heev mus rau sab saum toj ntawm cov saw hlau muaj nqis thoob ntiaj teb.
Lub sijhawm tshaj tawm: Lub Rau Hli-03-2025