Electrodeposited (ED)tooj liab ntawv ciyog lub pob txha tsis pom ntawm cov khoom siv hluav taws xob niaj hnub no. Nws cov profile ultra-thin, siab ductility, thiab zoo heev conductivity ua rau nws tseem ceeb nyob rau hauv lithium roj teeb, PCBs, thiab hloov tau yooj yim electronics. Tsis zoo lidov tooj liab ntawv ci, uas cia siab rau mechanical deformation,ED tooj liab ntawv ciyog tsim los ntawm electrochemical deposition, ua tiav atomic-theem tswj thiab kev ua tau zoo customization. Kab lus no nthuav tawm qhov tseeb tom qab nws cov khoom tsim thiab yuav ua li cas cov txheej txheem kev tsim kho tshiab hloov pauv kev lag luam.
I. Standardized Production: Precision hauv Electrochemical Engineering
1. Kev Npaj Electrolyte: Ib qho Nano-Optimized Formula
Lub hauv paus electrolyte muaj xws li high-purity tooj liab sulfate (80–120g / L Cu²⁺) thiab sulfuric acid (80–150g / L H₂SO₄), nrog gelatin thiab thiourea ntxiv ntawm qib ppm. Advanced DCS systems tswj kub (45-55 ° C), tus nqi ntws (10-15 m³ / h), thiab pH (0.8-1.5) nrog precision. Additives adsorb rau cathode los coj nano-level grain tsim thiab inhibit qhov tsis xws luag.
2. Foil Deposition: Atomic Precision hauv Kev Ua
Nyob rau hauv electrolytic hlwb nrog titanium cathode yob (Ra ≤ 0.1μm) thiab txhuas alloy anodes, 3000-5000 A/m² DC tam sim no tsav tooj liab ion deposition ntawm lub cathode nto nyob rau hauv (220) orientation. Ntawv nyiaj thickness (6-70μm) yog precisely tuned ntawm yob ceev (5-20 m / min) thiab tam sim no hloov, ua tiav ± 3% thickness tswj. Cov ntawv ci nyias tuaj yeem ncav cuag 4μm-1/20th thickness ntawm tib neeg cov plaub hau.
3. Ntxuav: Ultra-Clean Surfaces nrog dej ntshiab
Peb-theem rov qab rinsing system tshem tawm tag nrho cov seem: Theem 1 siv cov dej ntshiab (≤5μS / cm), Theem 2 siv ultrasonic nthwv dej (40kHz) kom tshem tawm cov kab mob organic, thiab Theem 3 siv cua sov (80-100 ° C) kom qhuav tsis muaj chaw. Qhov no ua rautooj liab ntawv cinrog qib oxygen <100ppm thiab sulfur residue <0.5μg/cm².
4. Slitting thiab ntim: Precision mus rau qhov kawg Micron
High-speed slitting tshuab nrog laser ntug tswj xyuas kom dav dav nyob rau hauv ± 0.05mm. Lub tshuab nqus tsev los tiv thaiv oxidation ntim nrog cov av noo ntsuas khaws cia qhov chaw zoo thaum thauj thiab khaws cia.
II. Kev kho deg Customization: Unlocking Industry-Specific Performance
1. Roughening Treatments: Micro-Anchoring rau Enhanced Bonding
Nodule Kev Kho Mob:Pulse plating hauv CuSO₄-H₂SO₄-As₂O₃ kua tsim 2–5μm nodules ntawm cov ntawv ci, txhim kho adhesion zog rau 1.8–2.5N / mm—zoo tagnrho rau 5G Circuit Court boards.
Dual-Peak Roughening:Micro- thiab nano-scale tooj liab hais nce thaj tsam ntawm 300%, txhim kho slurry adhesion hauv lithium roj teeb anodes los ntawm 40%.
2. Functional Plating: Molecular-Scale Armor rau Durability
Zinc / Tin Plating:Ib txheej txheej hlau 0.1-0.3μm txuas ntxiv ntsev tsuag los ntawm 4 mus rau 240 teev, ua rau nws mus rau EV roj teeb tabs.
Nickel-Cobalt Alloy Txheej:Pulse-plated nano-grain txheej (≤50nm) ua tiav HV350 hardness, txhawb nqa bendable substrates rau foldable smartphones.
3. Kev Tiv Thaiv Kub Kub: Ciaj sia nyob rau qhov siab heev
Sol-gel SiO₂-Al₂O₃ coatings (100–200nm) pab cov ntawv ci tiv thaiv oxidation ntawm 400 ° C (oxidation <1mg / cm²), ua rau nws zoo meej match rau aerospace wiring systems.
III. Txhawb nqa peb Cov Kev Lag Luam Loj Loj
1. Cov roj teeb hluav taws xob tshiab
CIVEN METAL's 3.5μm ntawv ci (≥200MPa tensile, ≥3% elongation) nce 18650 roj teeb zog ceev los ntawm 15%. Kev cai perforated ntawv (30-50% porosity) pab tiv thaiv lithium dendrite tsim nyob rau hauv cov roj teeb solid-state.
2. Advanced PCBs
Low-profile (LP) ntawv ci nrog Rz ≤1.5μm txo cov teeb liab poob hauv 5G millimeter-yoj boards los ntawm 20%. Ultra-low profile (VLP) ntawv ci nrog rov qab kho tiav (RTF) txhawb cov ntaub ntawv tus nqi ntawm 100Gb / s.
3. Cov khoom siv hluav taws xob hloov tau yooj yim
AnnealedED tooj liab ntawv ci(≥20% elongation) laminated nrog PI films withstands tshaj 200,000 khoov (1mm vojvoog), ua raws li "cov pob txha hloov tau" ntawm wearables.
IV. CIVEN METAL: Tus Thawj Coj Kev Cai hauv ED Copper Foil
Raws li lub zog ntsiag to hauv ED tooj liab ntawv ci,CIVEN METALtau tsim ib qho agile, modular manufacturing system:
Nano-Additive Library:Ntau tshaj 200 qhov sib xyaw ua ke ua kom haum rau lub zog tensile siab, elongation, thiab thermal stability.
AI-Guided Foil Production:AI-optimized tsis ua kom ntseeg tau ± 1.5% thickness raug thiab ≤2I flatness.
Surface Treatment Hub:12 kab mob siab rau muab 20+ customizable xaiv (roughening, plating, coatings).
Tus nqi tsim tawm:Nyob rau hauv-kab pov tseg rov qab boosts raw tooj liab siv rau 99.8%, txo cov kev cai foil nqi los ntawm 10-15% hauv qab no ua lag luam nruab nrab.
Los ntawm atomic lattice tswj mus rau macro-scale kev ua tau zoo tuning,ED tooj liab ntawv cisawv cev rau lub sijhawm tshiab ntawm cov khoom siv engineering. Raws li kev hloov pauv thoob ntiaj teb mus rau kev siv hluav taws xob thiab cov khoom siv ntse nrawm nrawm,CIVEN METALcoj tus nqi nrog nws "atomic precision + daim ntawv thov kev tsim kho tshiab" qauv - thawb Tuam Tshoj txoj kev tsim khoom siab heev mus rau sab saum toj ntawm lub ntiaj teb tus nqi saw.
Post lub sij hawm: Jun-03-2025