Hauv thaj teb ntawmtooj liab ntawv cikev tsim khoom, roughening tom qab kev kho mob yog cov txheej txheem tseem ceeb rau kev xauv cov khoom siv lub zog sib txuas. Kab lus no txheeb xyuas qhov tsim nyog ntawm kev kho mob roughening los ntawm peb qhov kev xav: mechanical anchoring effect, txheej txheem kev siv txoj hauv kev, thiab qhov kawg-siv adaptability. Nws kuj tseem tshawb nrhiav tus nqi ntawm cov cuab yeej siv no hauv thaj chaw xws li 5G kev sib txuas lus thiab cov roj teeb hluav taws xob tshiab, raws liCIVEN METAL's technical breakthroughs.
1. Roughening Treatment: Los ntawm "Smooth Trap" mus rau "Anchored Interface"
1.1 Qhov Tsis Txaus Siab Tuag Ntawm Qhov Ntog
Tus thawj roughness (Ra) ntawmtooj liab ntawv ciQhov chaw feem ntau tsawg dua 0.3μm, uas ua rau cov teeb meem hauv qab no vim nws cov yam ntxwv zoo li iav:
- Lub cev Bonding tsis txaus: Qhov chaw tiv tauj nrog cov resin tsuas yog 60-70% ntawm tus nqi theoretical.
- Chemical Bonding Barriers: Ib txheej txheej oxide tuab (Cu₂O thickness txog 3-5nm) cuam tshuam qhov cuam tshuam ntawm pawg neeg nquag.
- Thermal Stress Sensitivity: Qhov sib txawv hauv CTE (Coefficient of Thermal Expansion) tuaj yeem ua rau cuam tshuam kev cuam tshuam (ΔCTE = 12ppm / ° C).
1.2 Peb Qhov Kev Ua Haujlwm Tseem Ceeb hauv Cov Txheej Txheem Roughening
| Txheej txheem Parameter | Tsob Ntoo Copper Foil | Roughened Copper Ntawv Nyiaj | Kev txhim kho |
| Nto Roughness Ra (μm) | 0.1-0.3 hli | 0.8-2.0 | 700-900% |
| Qhov chaw tshwj xeeb (m² / g) | 0.05-0.08 Nws | 0.15-0.25 dr hab | 200-300% |
| Peel zog (N / cm) | 0.5-0.7 hli | 1.2-1.8 Nws | 140-257% |
Los ntawm kev tsim lub micron-theem peb-dimensional qauv (saib daim duab 1), cov txheej roughened ua tiav:
- Mechanical Interlocking: Resin penetration forms "barbed" anchoring (qhov tob> 5μm).
- Tshuaj tua kab mob: Exposing (111) high-activity siv lead ua dav hlau nce kev sib txuas ntawm qhov chaw ceev mus rau 10⁵ qhov chaw / μm².
- Thermal Stress Buffering: Cov qauv ntxeem tau absorbs tshaj 60% ntawm thermal stress.
- Txoj Kev: Acidic tooj liab plating tov (CuSO₄ 80g / L, H₂SO₄ 100g / L) + Pulse Electro-deposition (lub voj voog 30%, zaus 100Hz)
- Cov yam ntxwv zoo:
- Copper dendrite qhov siab 1.2-1.8μm, txoj kab uas hla 0.5-1.2μm.
- Nto oxygen cov ntsiab lus ≤200ppm (XPS tsom xam).
- Tiv tauj tsis kam <0.8mΩ·cm².
- Txoj Kev: Cobalt-nickel alloy plating tov (Co² + 15g / L, Ni² + 10g / L) + Tshuaj Tawm Tsam Tawm (pH 2.5-3.0)
- Cov yam ntxwv zoo:
- CoNi alloy particle loj 0.3-0.8μm, stacking ceev > 8 × 10⁴ hais/mm².
- Nto oxygen cov ntsiab lus ≤150ppm.
- Tiv tauj tsis kam <0.5mΩ·cm².
2. Liab Oxidation vs. Dub Oxidation: Cov txheej txheem Secrets qab cov xim
2.1 Liab Oxidation: Copper's "Armor"
2.2 Dub Oxidation: Cov Alloy "Armor"
2.3 Kev Lag Luam Logic Tom Qab Xaiv Xim
Txawm hais tias qhov tseem ceeb ntawm kev ua tau zoo (adhesion thiab conductivity) ntawm liab thiab dub oxidation txawv los ntawm tsawg dua 10%, kev ua lag luam qhia tau hais tias qhov sib txawv:
- Liab Oxidized Copper Foil: Cov nyiaj rau 60% ntawm kev ua lag luam feem ntau vim nws cov nqi tseem ceeb (12 CNY/m² vs. dub 18 CNY/m²).
- Dub Oxidized Copper Ntawv Nyiaj: Dominates lub lag luam high-end (lub tsheb-mounted FPC, millimeter-yoj PCBs) nrog 75% kev ua lag luam feem vim:
- 15% txo qis hauv kev poob siab (Df = 0.008 vs. liab oxidation 0.0095 ntawm 10GHz).
- 30% txhim kho CAF (Conductive Anodic Filament) tsis kam.
3. CIVEN METAL: "Nano-Level Masters" ntawm Roughening Technology
3.1 Lub tswv yim "Gradient Roughening" Technology
Los ntawm kev tswj peb-theem,CIVEN METALoptimizes nto qauv (saib daim duab 2):
- Nano-Crystalline Seed TxheejElectro-deposition ntawm tooj liab cores 5-10nm nyob rau hauv loj, ceev > 1 × 10¹¹ particles/cm².
- Micron Dendrite Kev Loj Hlob: Pulse tam sim no tswj dendrite orientation (preoritizing (110) kev taw qhia).
- Nto Passivation: Organic silane coupling agent (APTES) txheej txhim kho oxidation tsis kam.
3.2 Kev ua tau zoo tshaj li cov qauv kev lag luam
| Cov khoom kuaj | IPC-4562 Txuj | CIVEN METALCov ntaub ntawv ntsuas | Qhov zoo |
| Peel zog (N / cm) | ≥0.8 | 1.5-1.8 Nws | +87-125% |
| Nto Roughness CV tus nqi | ≤ 15% | ≤8% | -47% |
| Powder Poob (mg / m²) | ≤0.5 | ≤0.1 | -80% |
| Humidity kuj (h) | 96 (85 ° C / 85% RH) | 240 | +150% |
3.3 End-Siv Daim Ntawv Thov Matrix
- 5G Base chaw nres tsheb PCB: Siv cov ntawv nyiaj dub oxidized tooj liab (Ra = 1.5μm) kom ua tiav <0.15dB/cm ntxig poob ntawm 28GHz.
- Fais fab roj teeb Collector: Liab oxidizedtooj liab ntawv ci(lub zog tensile 380MPa) muab lub neej voj voog> 2000 cycles (national standard 1500 cycles).
- Aerospace FPCs: Cov txheej roughened tiv thaiv thermal shock los ntawm -196 ° C rau + 200 ° C rau 100 cycles yam tsis muaj delamination.
4. Yav Tom Ntej Battlefield rau Roughened Copper Foil
4.1 Ultra-Roughening Technology
Rau 6G terahertz kev sib txuas lus xav tau, tus qauv serrated nrog Ra = 3-5μm tau tsim:
- Dielectric tsis tu ncua Stability: Txhim kho rau ΔDk < 0.01 (1-100GHz).
- Thermal Resistance: Txo los ntawm 40% (ua tiav 15W / m·K).
4.2 Ntse Roughening Systems
Integrated AI pom kev pom + kev hloov pauv hloov pauv:
- Real-Time Surface Monitoring: Sampling zaus 100 ntas ib ob.
- Adaptive Current Density AdjustmentPrecision ± 0.5A / dm².
Copper foil roughening post-treatment has evolved from a "optional process" to a "performance multiplier." Los ntawm cov txheej txheem innovation thiab kev tswj kom zoo,CIVEN METALtau thawb roughening thev naus laus zis mus rau atomic-theem precision, muab cov khoom siv hauv paus rau kev txhim kho kev lag luam hluav taws xob. Nyob rau hauv lub neej yav tom ntej, nyob rau hauv kev sib tw rau smarter, ntau zaus, thiab ntau txhim khu kev qha technologies, leej twg masters tus "micro-level code" ntawm roughening technology yuav dominate lub tswv yim siab hauv av.tooj liab ntawv cikev lag luam.
(Cov ntaub ntawv Source:CIVEN METAL2023 Daim Ntawv Qhia Txog Kev Qhia Ib Xyoo, IPC-4562A-2020, IEC 61249-2-21)
Post lub sij hawm: Apr-01-2025