Passivation yog txheej txheem tseem ceeb hauv kev tsim cov dovtooj liab ntawv ci. Nws ua raws li "molecular-level shield" rau ntawm qhov chaw, txhim kho corrosion kuj thaum ua tib zoo ntsuas nws qhov cuam tshuam rau cov khoom tseem ceeb xws li conductivity thiab solderability. Kab lus no piav qhia txog kev tshawb fawb tom qab passivation mechanisms, kev ua lag luam kev lag luam, thiab kev coj ua engineering. SivCIVEN METAL's breakthroughs ua piv txwv, peb yuav tshawb nrhiav nws tus nqi tshwj xeeb hauv high-end electronics manufacturing.
1. Passivation: Ib qho "Molecular-Level Shield" rau Copper Foil
1.1 Yuav ua li cas cov txheej txheem Passivation
Los ntawm cov tshuaj los yog electrochemical kev kho mob, ib tug compact oxide txheej 10-50nm tuab ntaub ntawv nyob rau saum npoo ntawm lubtooj liab ntawv ci. Muaj feem ntau ntawm Cu₂O, CuO, thiab cov organic complexes, txheej txheej no muab:
- Lub cev Barriers:Cov pa oxygen diffusion coefficient txo mus rau 1 × 10⁻¹⁴ cm² / s (los ntawm 5 × 10⁻⁸ cm² / s rau liab qab tooj liab).
- Electrochemical Passivation:Corrosion tam sim no ceev poob los ntawm 10μA / cm² rau 0.1μA / cm².
- Chemical Inertness:Nto lub zog tsis muaj zog yog txo los ntawm 72mJ / m² rau 35mJ / m², suppressing reactive cwj pwm.
1.2 Tsib qhov txiaj ntsig tseem ceeb ntawm Passivation
| Performance Aspect | Tsis Siv Neeg Copper Foil | Passivated tooj liab ntawv ci | Kev txhim kho |
| Ntsej Tsuag Test (teev) | 24 (pob txha pob txha) | 500 (tsis pom corrosion) | + 1983% |
| Kev kub siab oxidation (150 ° C) | 2 teev (dub dub) | 48 teev (tsim xim) | + 2300% |
| Lub neej cia | 3 lub hlis (nqus-packed) | 18 lub hlis (tus qauv ntim) | +500% |
| Tiv tauj Resistance (mΩ) | 0.25 | 0.26 (+4%) | - |
| High-Frequency Insertion Poob (10GHz) | 0.15dB/cm | 0.16dB/cm (+6.7%) | - |
2. Tus "ob-Edged ntaj" ntawm Passivation Layers—thiab Yuav Ua Li Cas Ntsuas Nws
2.1 Kev Ntsuas Cov Kev pheej hmoo
- Kev txo qis hauv conductivity:Cov txheej txheej passivation nce ntawm daim tawv nqaij qhov tob (ntawm 10GHz) los ntawm 0.66μm mus rau 0.72μm, tab sis los ntawm kev ua kom tuab hauv qab 30nm, kev tiv thaiv tuaj yeem raug txwv rau qis dua 5%.
- Soldering Challenges:Lub zog ntawm lub zog qis dua tuaj yeem ua rau lub kaum sab xis ntawm 15 ° txog 25 °. Kev siv cov tshuaj nplaum nplaum nplaum (RA hom) tuaj yeem cuam tshuam cov nyhuv no.
- Cov teeb meem adhesion:Resin bonding zog tuaj yeem poob 10-15%, uas tuaj yeem txo tau los ntawm kev sib txuas cov txheej txheem roughening thiab passivation.
2.2CIVEN METAL's Balancing Approach
Gradient Passivation Technology:
- Base Txheej:Electrochemical kev loj hlob ntawm 5nm Cu₂O nrog (111) nyiam orientation.
- Nruab nrab Txheej:A 2–3nm benzotriazole (BTA) self-assembled zaj duab xis.
- Txheej txheej:Silane coupling tus neeg sawv cev (APTES) los txhim kho resin adhesion.
Optimized Performance Results:
| Metric | IPC-4562 Cov Lus Qhia | CIVEN METALCopper Foil Results |
| Surface Resistance (mΩ/sq) | ≤300 | 220–250 : kuv |
| Peel zog (N / cm) | ≥0.8 | 1.2–1.5 hli |
| Solder Joint Tensile zog (MPa) | ≥ 25 | 28–32 : kuv |
| Ionic Migration Rate (μg / cm²) | ≤0.5 | 0.2–0.3 hli |
3. CIVEN METAL's Passivation Technology: Redefining Protection Standards
3.1 A Four-Tier Protection System
- Ultra-Thin Oxide Control:Pulse anodization ua tiav thickness variation nyob rau hauv ± 2nm.
- Organic-Inorganic Hybrid Layers:BTA thiab silane ua hauj lwm ua ke los txo tus nqi corrosion rau 0.003mm / xyoo.
- Surface Activation Treatment:Plasma tu (Ar / O₂ roj sib tov) rov ua kom cov plaub hau ntub dej rau 18 °.
- Kev saib xyuas lub sijhawm tiag tiag:Ellipsometry ua kom cov txheej txheem passivation tuab hauv ± 0.5nm.
3.2 Kev lees paub ib puag ncig huab cua
- High Humidity thiab Kub:Tom qab 1,000 teev ntawm 85 ° C / 85% RH, qhov chaw tiv thaiv kev hloov pauv tsawg dua 3%.
- Thermal shock:Tom qab 200 lub voj voog ntawm -55 ° C rau + 125 ° C, tsis muaj kab nrib pleb tshwm nyob rau hauv cov txheej txheem passivation (kev lees paub los ntawm SEM).
- Chemical Resistance:Kev tiv thaiv rau 10% HCl vapor nce ntawm 5 feeb mus rau 30 feeb.
3.3 Compatibility Hla Daim Ntawv Thov
- 5G millimeter-Wave Antennas:28GHz insertion poob tsuas yog 0.17dB/cm (piv rau cov neeg sib tw 0.21dB/cm).
- Automotive Electronics:Dhau ISO 16750-4 kev ntsuas ntsev ntsev, nrog rau ncua mus txog 100.
- IC substrates:Adhesion zog nrog ABF resin ncav cuag 1.8N / cm (qhov nruab nrab ntawm kev lag luam: 1.2N / cm).
4. Lub neej yav tom ntej ntawm Passivation Technology
4.1 Atomic Layer Deposition (ALD) Technology
Tsim cov nanolaminate passivation films raws li Al₂O₃/TiO₂:
- Thickness:<5nm, nrog resistivity nce ≤1%.
- CAF (Conductive Anodic Filament) Resistance:5 x kev txhim kho.
4.2 Kev Kho Tus Kheej Passivation Txheej
Incorporating microcapsule corrosion inhibitors (benzimidazole derivatives):
- Self-kho Efficiency:Tshaj 90% hauv 24 teev tom qab khawb.
- Lub neej ua haujlwm:Txuas ntxiv mus rau 20 xyoo (piv rau tus qauv 10-15 xyoo).
Xaus:
Kev kho mob Passivation ua tiav qhov sib npaug ntawm kev tiv thaiv thiab kev ua haujlwm rau dovtooj liab ntawv ci. Los ntawm innovation,CIVEN METALminimizes passivation downsides, tig nws mus rau hauv ib tug "invisible armor" uas boosts khoom kev ntseeg tau. Raws li kev lag luam hluav taws xob hloov mus rau qhov ceev dua thiab kev ntseeg siab, qhov tseeb thiab kev tswj hwm passivation tau dhau los ua lub hauv paus ntawm kev tsim cov ntawv ci tooj liab.
Post lub sij hawm: Mar-03-2025