Tin plating muab "cov khoom siv hlau nplaum" rautooj liab ntawv ci, tawm tsam qhov sib npaug zoo tshaj plaws ntawm kev sib tw, kev tiv thaiv corrosion, thiab cov nqi ua haujlwm. Cov kab lus no rhuav tshem li cas tin-plated tooj liab ntawv ci tau dhau los ua cov khoom tseem ceeb rau cov neeg siv khoom thiab cov khoom siv hluav taws xob tsheb. Nws qhia txog cov txheej txheem tseem ceeb ntawm kev sib txuas ntawm atomic, cov txheej txheem tshiab, thiab kev siv kawg, thaum tshawb nrhiavCIVEN METALKev nce qib hauv tin plating technology.
1. Peb qhov tseem ceeb ntawm Tin Plating
1.1 Quantum Leap hauv Soldering Performance
Ib txheej tin (kwv yees li 2.0μm tuab) revolutionizes soldering nyob rau hauv ntau txoj kev:
- Kev Kub Kub Kub Kub: Tin melts ntawm 231.9 ° C, txo qhov kub ntawm tooj liab ntawm 850 ° C mus rau 250-300 ° C.
- Txhim kho qhov ntub dej: Tin qhov nro ntawm qhov chaw poob los ntawm tooj liab 1.3N / m txog 0.5N / m, nce qhov chaw sib kis los ntawm 80%.
- Optimized IMCs (Intermetallic Compounds): Ib Cu₆Sn₅/Cu₃Sn gradient txheej tsub kom shear zog rau 45MPa (liab tooj liab soldering ua tiav xwb 28MPa).
1.2 Corrosion Resistance: Ib "Dynamic Barrier"
| Corrosion Scenario | Lub Sijhawm Tsis Muaj Nuj Nqis | Tin-Plated Copper Failure Time | Kev Tiv Thaiv Tus Kheej |
| Muaj Cuab Yeej | 6 hli (ntsuab xeb) | 5 xyoos (yuag poob <2%) | 10 x |
| Sweat Corrosion (pH = 5) | 72 teev (perforation) | 1,500 teev (tsis muaj kev puas tsuaj) | 20 x |
| Hydrogen Sulfide Corrosion | 48 teev (blackened) | 800 teev (tsis muaj xim) | 16 x |
1.3 Kev coj tus cwj pwm: Ib qho "Micro-Sacrifice" Strategy
- Hluav taws xob tiv taus nce me ntsis, los ntawm 12% (1.72 × 10⁻⁸ txog 1.93 × 10⁻⁸ Ω·m).
- Cov nyhuv ntawm daim tawv nqaij txhim kho: Ntawm 10GHz, daim tawv nqaij qhov tob nce los ntawm 0.66μm mus rau 0.72μm, uas ua rau qhov kev tso tawm poob tsuas yog 0.02dB / cm.
2. Cov Txheej Txheem Txheej Txheem: "Txiav vs. Plating"
2.1 Plating tag nrho (txiav ua ntej plating)
- Qhov zoo: Ntug tau npog tag nrho, tsis muaj tooj liab.
- Kev Sib Tw Txuj Ci:
- Burrs yuav tsum tau tswj hauv qab 5μm (cov txheej txheem ib txwm muaj tshaj 15μm).
- Plating tov yuav tsum nkag mus rau ntau tshaj 50μm kom ntseeg tau tias cov ntug zoo sib xws.
2.2 Tom qab txiav Plating (Plating ua ntej txiav)
- Cov txiaj ntsig raug nqi: Ua kom ua tau zoo ntawm 30%.
- Cov teeb meem tseem ceeb:
- Cov npoo tooj liab nthuav tawm ntawm 100-200μm.
- Cov tshuaj tsuag ntsev lub neej raug txo los ntawm 40% (los ntawm 2,000 teev txog 1,200 teev).
2.3CIVEN METAL's "Zero-Defect" Txoj Kev
Ua ke laser precision txiav nrog mem tes tin plating:
- Txiav raug: Burrs khaws cia hauv qab 2μm (Ra = 0.1μm).
- Ntug Coverage: Sab plating thickness ≥0.3μm.
- Nqi-zoo: Tus nqi 18% qis dua cov txheej txheem plating tag nrho.
3. CIVEN METALTin-platedCopper Foil: Kev Sib Yuav Ntawm Kev Tshawb Fawb thiab Kev Zoo Nkauj
3.1 Precise Control ntawm Txheej Morphology
| Hom | Txheej txheem Parameter | Ntsiab nta |
| Ci Tin | Tam sim no ceev: 2A / dm², additive A-2036 | Reflectivity > 85%, Ra = 0.05μm |
| Matte Tin | Tam sim no ceev: 0.8A / dm², tsis muaj additives | Reflectivity <30%, Ra = 0.8μm |
3.2 Superior Performance Metrics
| Metric | Kev lag luam nruab nrab |CIVEN METALTin-plated tooj liab | Kev txhim kho |
| Txheej Thickness Deviation (%) | ± 20 | ± 5 | -75% |
| Solder Void Rate (%) | 8–12 | ≤3 | -67% |
| Khoov Resistance (lub voj voog) | 500 (R = 1mm) | 1,500 | +200% |
| Tin Whisker Loj hlob (μm/1,000h) | 10–15 | ≤2 | -80% |
3.3 Cov Chaw Siv Tseem Ceeb
- Smartphone FPCs: Matte tin (thickness 0.8μm) kom ruaj khov soldering rau 30μm kab / qhov sib nrug.
- Automotive ECUs: Ci tin tuaj yeem tiv taus 3,000 lub voj voog thermal (-40 ° C↔ + 125 ° C) uas tsis muaj kev sib koom ua ke.
- Photovoltaic Junction Boxes: Ob chav sided tin plating (1.2μm) ua tiav kev tiv thaiv <0.5mΩ, boosting efficiency los ntawm 0.3%.
4. Lub neej yav tom ntej ntawm Tin Plating
4.1 Nano-Composite Txheej
Tsim Sn-Bi-Ag ternary alloy txheej:
- Txo cov ntsiab lus melting mus rau 138 ° C (zoo tagnrho rau cov khoom siv hluav taws xob qis qis).
- Txhim kho creep tsis kam los ntawm 3x (tshaj 10,000 teev ntawm 125 ° C).
4.2 Ntsuab Tin Plating Revolution
- Cyanide-Free Solutions: Txo cov dej khib nyiab COD los ntawm 5,000mg / L txog 50mg / L.
- High Tin Recovery Rate: Tshaj 99.9%, txiav cov nqi ntawm 25%.
Tin plating transformstooj liab ntawv cilos ntawm tus neeg xyuas pib yooj yim mus rau "cov khoom siv ntse interface."CIVEN METAL's atomic-theem txheej txheem tswj thawb qhov kev ntseeg tau thiab ib puag ncig resilience ntawm tin-plated tooj liab ntawv ci rau qhov siab tshiab. Raws li cov neeg siv khoom siv hluav taws xob poob qis thiab cov khoom siv hluav taws xob hauv tsheb xav tau kev ntseeg siab dua,tin-plated tooj liab ntawv citau dhau los ua lub hauv paus ntawm kev sib txuas ua ke.
Post lub sij hawm: May-14-2025