Copper Foil thiab Copper Sawb: Kev Ntsuam Xyuas Kev Tshaj Tawm los ntawm Cov Txheej Txheem Ntau Lawm rau Cov Ntawv Thov

Hauv kev tsim cov khoom siv tooj liab, "tooj liab ntawv ci"thiab"tooj liab stripRau cov neeg tsis yog cov kws tshaj lij, qhov sib txawv ntawm ob yuav zoo li tsuas yog lus, tab sis hauv kev tsim khoom, qhov kev sib txawv no cuam tshuam ncaj qha rau kev xaiv cov khoom, cov txheej txheem, thiab cov khoom siv zaum kawg. Kab lus no tau txheeb xyuas lawv qhov sib txawv ntawm peb qhov tseem ceeb: cov qauv kev tsim khoom, thiab kev siv hauv kev lag luam.

1. Thickness Standard: Lub Industrial Logic Qab ntawm 0.1mm Threshold

Los ntawm txoj kev xav thickness,0.1 hliyog qhov tseem ceeb sib faib kab ntawm tooj liab strips thiab tooj liab foils. CovInternational Electrotechnical Commission (IEC)tus qauv qhia meej meej:

• Tooj Liab: Nruam cov khoom siv tooj liab nrog lub thickness≥0.1mm
• Copper Foil: Ultra-nyias cov khoom siv tooj liab nrog lub thickness<0.1 hli

Qhov kev faib tawm no tsis yog arbitrary tab sis yog raws li cov khoom ua cov yam ntxwv:
Thaum lub thickness tshaj0.1 hli, cov khoom ua tiav qhov sib npaug ntawm ductility thiab mechanical zog, ua rau nws haum rau kev ua haujlwm theem nrab xws li stamping thiab dabtsi yog khoov. Thaum lub thickness poob hauv qab0.1 hli, txoj kev ua yuav tsum hloov mus rau precision dov, qhov twgnto zoo thiab thickness uniformityua qhov taw qhia tseem ceeb.

Nyob rau hauv niaj hnub industrial ntau lawm, mainstreamtooj liab stripcov ntaub ntawv feem ntau nyob nruab nrab ntawm0.15mm thiab 0.2mm. Piv txwv li, hauvNew zog tsheb (NEV) roj teeb, 0.18mm electrolytic tooj liab sawbyog siv los ua raw khoom. Los ntawm ntau tshaj20 passes ntawm precision dov, nws yog thaum kawg ua rau ultra-nyiastooj liab ntawv cixws li los ntawm6m mus 12m, nrog lub thickness kam rau ua± 0.5 hli.

2. Kev kho deg: Kev sib txawv ntawm kev siv tshuab ua haujlwm los ntawm kev ua haujlwm

Standard Treatment rau Copper Sawb:

1. Alkaline Ntxuav - Tshem tawm cov roj residues
2. Chromate Passivation -Forms ib0.2-0.5 hlitiv thaiv txheej
3. Qhuav thiab Shaping

Txhim kho kev kho mob rau tooj liab ntawv ci:

Ntxiv nrog rau cov txheej txheem tooj liab, tooj liab foil undergoes:

1. Electrolytic Degreasing - Siv3-5A / dm² tam sim no ceevntawm50-60 ° C
2. Nano-Level Surface Roughening - Tswj Ra tus nqi nruab nrab0.3-0.8 hli
3. Anti-Oxidation Silane Kev Kho Mob

Cov txheej txheem ntxiv no haum rautshwj xeeb kawg-siv cov cai:
In Printed Circuit Board (PCB) raug tsim, tooj liab ntawv ci yuav tsum tsim ibmolecular-level bondnrog resin substrate. Txawmmicron qib roj residuetuaj yeem ua raudelamination defects. Cov ntaub ntawv los ntawm cov chaw tsim khoom PCB ua tau qhia tiaselectrolytic degreased tooj liab ntawv citxhim khotev lub zog los ntawm 27%thiab txodielectric poob los ntawm 15%.

3. Kev Lag Luam Kev Lag Luam: Los ntawm cov khoom siv raw mus rau cov khoom siv ua haujlwm

tooj liab stripua hauj lwm ua ib“Basic Material Supplier”nyob rau hauv cov khoom saw, feem ntau yog siv nyob rau hauv:

• Cov khoom siv fais fabTom ntej: Transformer windings (0.2-0.3mm tuab)
• Industrial Connectors: Terminal conductive ntawv (0.15-0.25mm tuab)
• Kev siv Architectural: vov tsev cov khaubncaws sab nraud povtseg (0.3-0.5mm tuab)

Piv txwv li, tooj liab ntawv ci tau hloov zuj zus mus rau hauv ib qho"cov khoom siv ua haujlwm"uas yog irreplaceable nyob rau hauv:

nojroj teeb fais fabPiv txwv li, tooj liab ntawv nyiaj rau10-15%ntawm tus nqi ntawm cov khoom siv cell. Txhua1m txonyob rau hauv thickness nceroj teeb zog ceev los ntawm 0.5%. Qhov no yog vim li cas cov thawj coj kev lag luam nyiamCATLyog thawb tooj liab ntawv ci thickness rau4m ua.

4. Technological Evolution: Kev sib koom ua ke ib thaj tsam thiab kev ua haujlwm zoo

Nrog rau kev nce qib hauv cov ntaub ntawv tshawb fawb, ib txwm ciam teb ntawm cov ntawv ci tooj liab thiab tooj liab yog maj mam hloov:

1. Ultra-Thin Copper Sawb: 0.08mm "quasi-foil" khoomtam sim no siv rauelectromagnetic shielding.
2. Composite Copper Foil: 4.5μm tooj liab + 8μm polymer substratetsim cov qauv "sandwich" uas rhuav tshem lub cev.
3. Functionalized Copper Sawb: Carbon-coated tooj liab strips qhibtshiab frontiers nyob rau hauv roj cell bipolar daim hlau.

Cov kev tsim kho tshiab no xav taucov qauv tsim ntau dua. Raws li ib tug loj tooj liab tsim, sivmagnetron sputtering technologyrau composite tooj liab strips tau txounit-chaw tiv thaiv los ntawm 40%thiab txhim khokhoov qaug zog lub neej los ntawm 3 zaug.

Xaus: Tus Nqi Tom Qab Kev Txawj Ntse

To taub qhov txawv ntawmtooj liab stripthiabtooj liab ntawv ciyog lub hauv paus ntawm kev tuav lub"quantitative rau qualitative"hloov pauv hauv cov khoom siv engineering. Los ntawm0.1 hli thickness pibraumicron-level kev kho mobthiabnanometer-scale interface tswj, txhua qhov kev siv thev naus laus zis tau hloov kho qhov kev lag luam toj roob hauv pes.

Hauvcarbon neutrality era, qhov kev paub no yuav cuam tshuam ncaj qhaib lub tuam txhab kev sib twhauv cov khoom siv tshiab. Tom qab tag nrho, nyob rau hauv lubfais fab roj teeb kev lag luam, a0.1mm qhov sib txawv hauv kev nkag siabyuav txhais tau tias ibtag nrho tiam ntawm technology sib txawv.