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• Kev cia siab thiab kev tswj hwm cua sov
• : is widely used in lead frame packaging, especially for power device packaging. Cov ncej txhuas muab kev txhawb nqa thiab hluav taws xob txuas rau nti, xav tau cov ntaub ntawv nrog kev ua haujlwm zoo thiab zoo thermal conductivity. Copper foil meets these requirements, effectively reducing packaging costs while improving thermal dissipation and electrical performance.
• : In practical applications, copper foil often undergoes surface treatments such as nickel, tin, or silver plating to prevent oxidation and improve solderability. Cov kev kho no ntxiv txhim kho lub durability thiab kev ntseeg tau ntawm tooj liab ntawv ntawv hauv cov hmoov txhuas ntim.
• : System-in-pob cov thev naus laus zis sib xyaw ua ke ntau yam chips thiab passive Cheebtsam rau hauv ib lub pob ua kom tiav kev sib koom ua ke ntau dua thiab ua haujlwm nrawm. Tooj liab ntawv ci yog siv los tsim sab hauv interconnecting circuits thiab ua txoj hauv kev tam sim no. Daim ntawv thov no yuav tsum tau ci ntawv ci kom muaj kev ua haujlwm siab thiab ultra-nyias cov xeeb ceem kom ua tiav kev ua tau zoo hauv kev muaj chaw ntim khoom.
• Siv nyob rau hauv txheej txheem redistrituav (RDL): In fan-out packaging, copper foil is used to construct the redistribution layer, a technology that redistributes chip I/O to a larger area. Lub siab ua haujlwm thiab zoo adhesion ntawm tooj liab ntawv ci ua nws cov khoom siv zoo rau kev ua kom muaj cov khaubncaws sab nraud povtseg ua ke, nce ntom ntom thiab txhawb nqa ntau thiab kev koom ua ke ntau.
• Tooj liab ntawv kub dab dej sov thiab cua sov raws: Vim tias nws zoo heev thermal conductivity, tooj liab ntawv siv nyob rau hauv lub dab dej sov, thiab thermal interface hloov los ntawm lub nti mus rau sab nraud txias qauv. Daim ntawv thov no yog qhov tseem ceeb tshaj plaws hauv lub zog hluav taws xob thiab cov pob ntim uas yuav tsum tau tswj qhov kub thiab txias, xws li CPUs, GPUS, thiab kev tswj hwm hluav taws xob.
• Siv nyob rau hauv los ntawm-silicon ntawm (TSV) tshuab

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4. System-hauv-pob (SIP)

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