Cov ntawv thov ntawm Cov Ntawv Nyiaj Tooj Liab hauv Cov Ntim Chip

Cov ntawv ci tooj liabtab tom los ua ib qho tseem ceeb hauv kev ntim khoom siv chip vim nws cov hluav taws xob conductivity, thermal conductivity, processability, thiab kev siv nyiaj tsim nyog. Nov yog kev tshuaj xyuas ntxaws ntxaws ntawm nws cov ntawv thov tshwj xeeb hauv kev ntim khoom siv chip:

1. Kev Sib Txuas Hlau Tooj Liab

• Hloov rau Kub lossis Aluminium Hlau: Ib txwm muaj, cov xov kub lossis txhuas tau siv rau hauv kev ntim khoom siv hluav taws xob los txuas cov hluav taws xob sab hauv ntawm cov chip rau cov xov hlau sab nraud. Txawm li cas los xij, nrog kev nce qib hauv kev siv tshuab ua tooj liab thiab kev txiav txim siab txog tus nqi, cov ntawv ci tooj liab thiab cov xov hlau tooj liab maj mam dhau los ua cov kev xaiv tseem ceeb. Cov hluav taws xob ntawm tooj liab yog kwv yees li 85-95% ntawm kub, tab sis nws tus nqi yog kwv yees li ib feem kaum, ua rau nws yog qhov kev xaiv zoo tshaj plaws rau kev ua haujlwm siab thiab kev txuag nyiaj.
• Kev Ua Haujlwm Hluav Taws Xob Zoo Dua: Kev sib txuas ntawm cov hlau tooj liab muaj qhov tsis kam qis dua thiab muaj kev ua tau zoo dua ntawm cov cua sov hauv cov ntawv thov uas muaj zaus siab thiab tam sim no siab, txo qhov poob hluav taws xob hauv kev sib txuas ntawm cov chips thiab txhim kho kev ua haujlwm hluav taws xob tag nrho. Yog li, kev siv cov ntawv ci tooj liab ua cov khoom siv hluav taws xob hauv cov txheej txheem sib txuas tuaj yeem txhim kho kev ntim khoom thiab kev ntseeg siab yam tsis nce nqi.
• Siv rau hauv Electrodes thiab Micro-BumpsHauv cov ntim khoom flip-chip, lub chip raug tig kom cov input/output (I/O) pads ntawm nws qhov chaw txuas ncaj qha rau lub voj voog ntawm lub pob substrate. Cov ntawv ci tooj liab yog siv los ua cov electrodes thiab micro-bumps, uas tau soldered ncaj qha rau lub substrate. Qhov tsis kam thermal qis thiab conductivity siab ntawm tooj liab ua kom muaj kev xa cov teeb liab thiab lub zog zoo.
• Kev Ntseeg Tau thiab Kev Tswj Xyuas KubVim nws tiv taus hluav taws xob thiab lub zog kho tshuab, tooj liab muab kev ntseeg siab zoo dua rau lub sijhawm ntev hauv qab ntau yam kev hloov pauv thermal thiab qhov ceev tam sim no. Tsis tas li ntawd, tooj liab lub thermal conductivity siab pab sai sai dissipate cua sov tsim thaum lub sijhawm ua haujlwm chip rau lub substrate lossis lub dab dej cua sov, txhim kho lub peev xwm tswj thermal ntawm pob.
• Cov Khoom Siv Ua Los Ntawm Cov Hlau: Cov ntawv ci tooj liabsiv dav hauv kev ntim khoom siv lead, tshwj xeeb tshaj yog rau kev ntim khoom siv fais fab. Lub thav duab lead muab kev txhawb nqa thiab kev sib txuas hluav taws xob rau lub nti, xav tau cov ntaub ntawv uas muaj kev coj ua siab thiab kev coj ua kub zoo. Cov ntawv ci tooj liab ua tau raws li cov kev cai no, txo cov nqi ntim khoom thaum txhim kho kev faib tawm cua sov thiab kev ua haujlwm hluav taws xob.
• Cov Txheej Txheem Kho Qhov ChawHauv kev siv tiag tiag, cov ntawv ci tooj liab feem ntau raug kho saum npoo xws li nickel, tin, lossis silver plating kom tiv thaiv kev oxidation thiab txhim kho kev sib txuas. Cov kev kho no ua rau kom muaj kev ruaj khov thiab kev ntseeg siab ntawm cov ntawv ci tooj liab hauv cov thawv txhuas.
• Cov Khoom Siv Conductive hauv Multi-Chip Modules: Cov thev naus laus zis hauv lub pob khoom sib xyaw ua ke ntau lub chips thiab cov khoom tsis ua haujlwm rau hauv ib pob kom ua tiav kev sib koom ua ke thiab kev ua haujlwm ceev. Cov ntawv ci tooj liab yog siv los tsim cov voj voog sib txuas sab hauv thiab ua haujlwm ua txoj hauv kev tam sim no. Daim ntawv thov no xav kom cov ntawv ci tooj liab muaj kev ua tau zoo thiab cov yam ntxwv ultra-thin kom ua tiav kev ua tau zoo dua hauv qhov chaw ntim khoom tsawg.
• Cov Kev Siv RF thiab Millimeter-WaveCov ntawv ci tooj liab kuj tseem ua lub luag haujlwm tseem ceeb hauv cov voj voog xa xov tooj cua zaus siab hauv SiP, tshwj xeeb tshaj yog hauv xov tooj cua zaus (RF) thiab millimeter-wave daim ntawv thov. Nws cov yam ntxwv poob qis thiab kev coj ua zoo heev tso cai rau nws kom txo qhov teeb liab attenuation zoo thiab txhim kho kev xa xov zoo hauv cov ntawv thov zaus siab no.
• Siv rau hauv Cov Txheej Txheem Rov Faib Tawm (RDL)Hauv kev ntim khoom uas siv kiv cua tawm, cov ntawv ci tooj liab yog siv los tsim cov txheej faib rov qab, ib qho thev naus laus zis uas faib cov chip I/O rov qab mus rau thaj chaw loj dua. Qhov kev coj ua siab thiab kev nplaum zoo ntawm cov ntawv ci tooj liab ua rau nws yog cov khoom siv zoo tshaj plaws rau kev tsim cov txheej faib rov qab, ua rau I/O ceev dua thiab txhawb kev sib koom ua ke ntawm ntau lub chip.
• Kev Txo Qhov Loj thiab Kev Ncaj Ncees ntawm Lub Teeb LiabDaim ntawv thov ntawm cov ntawv ci tooj liab hauv cov txheej txheem rov faib khoom pab txo qhov loj ntawm pob khoom thaum txhim kho kev sib kis teeb liab thiab kev ceev, uas yog qhov tseem ceeb tshwj xeeb hauv cov khoom siv mobile thiab cov ntawv thov kev suav lej siab uas xav tau cov ntim khoom me dua thiab kev ua tau zoo dua.
• Cov Khoom Siv Kub Kub Tooj Liab thiab Cov Thermal ChannelsVim nws cov thermal conductivity zoo heev, cov ntawv ci tooj liab feem ntau siv rau hauv cov cua sov, cov channel thermal, thiab cov ntaub ntawv thermal interface hauv cov ntim khoom ntim khoom kom pab hloov cov cua sov uas tsim los ntawm cov nti mus rau cov qauv txias sab nraud sai sai. Daim ntawv thov no tseem ceeb heev rau cov chips muaj zog thiab cov pob khoom uas xav tau kev tswj qhov kub thiab txias meej, xws li CPUs, GPUs, thiab cov chips tswj fais fab.
• Siv rau hauv Through-Silicon Via (TSV) TechnologyHauv cov thev naus laus zis ntim khoom 2.5D thiab 3D chip, cov ntawv ci tooj liab yog siv los tsim cov khoom siv conductive rau through-silicon vias, muab kev sib txuas ntsug ntawm cov chips. Qhov conductivity siab thiab processability ntawm cov ntawv ci tooj liab ua rau nws yog cov khoom siv nyiam hauv cov thev naus laus zis ntim khoom siab heev no, txhawb kev sib koom ua ke ntau dua thiab cov teeb liab luv dua, yog li txhim kho kev ua haujlwm ntawm lub cev tag nrho.

2. Kev Ntim Khoom Siv Flip-Chip

3. Kev Ntim Khoom Siv Ua Los Ntawm Cov Hlau

4. System-in-Package (SiP)

5. Kev Ntim Khoom Siv Fan-Out

6. Kev Tswj Xyuas Thermal thiab Cov Ntawv Thov Kub Dissipation

7. Cov Txuj Ci Ntim Khoom Qib Siab (xws li 2.5D thiab 3D Ntim Khoom)

Zuag qhia tag nrho, kev siv cov ntawv ci tooj liab hauv cov ntim khoom nti tsis yog txwv rau kev sib txuas hluav taws xob ib txwm muaj thiab kev tswj hwm thermal tab sis nthuav dav mus rau cov thev naus laus zis ntim khoom tshiab xws li flip-chip, system-in-package, fan-out packaging, thiab 3D packaging. Cov khoom siv ntau yam thiab kev ua tau zoo zoo ntawm cov ntawv ci tooj liab ua lub luag haujlwm tseem ceeb hauv kev txhim kho kev ntseeg tau, kev ua tau zoo, thiab kev siv nyiaj tsawg ntawm cov ntim khoom nti.