tooj liab ntawv citau dhau los ua qhov tseem ceeb hauv cov ntim ntim vim nws cov hluav taws xob conductivity, thermal conductivity, processability, thiab nqi-zoo. Nov yog cov ncauj lus kom ntxaws ntawm nws cov ntawv thov tshwj xeeb hauv ntim ntim:
1. Copper Hlau Bonding
- Hloov rau kub lossis txhuas hlau: Raws li kev lig kev cai, cov xov tooj kub los yog txhuas tau siv rau hauv cov ntim ntim khoom siv hluav taws xob txuas rau cov nti sab hauv lub voj voog mus rau sab nraud. Txawm li cas los xij, nrog kev nce qib hauv kev siv tshuab tooj liab thiab kev xav txog tus nqi, cov ntawv ci tooj liab thiab tooj liab tau maj mam dhau los ua cov kev xaiv tseem ceeb. Tooj tooj hluav taws xob conductivity yog kwv yees li 85-95% ntawm kub, tab sis nws cov nqi yog ib feem kaum, ua rau nws yog ib qho kev xaiv zoo tshaj plaws rau kev ua haujlwm siab thiab kev lag luam.
- Txhim khu kev ua tau zoo hluav taws xob: Copper wire bonding muaj kev ua haujlwm qis dua thiab zoo dua thermal conductivity nyob rau hauv high-frequency thiab high-tam sim no daim ntaub ntawv, zoo txo hwj chim poob nyob rau hauv nti interconnections thiab txhim kho tag nrho cov hluav taws xob kev ua tau zoo. Yog li, siv cov ntawv ci tooj liab ua cov khoom siv hauv cov txheej txheem sib txuas tuaj yeem txhim kho kev ntim khoom thiab kev ntseeg siab yam tsis muaj nqi ntxiv.
- Siv hauv Electrodes thiab Micro-Bumps: Nyob rau hauv flip-chip ntim, lub nti yog flipped thiaj li hais tias lub input / output (I / O) pads ntawm nws nto ncaj qha mus rau lub Circuit Court ntawm lub pob substrate. Copper foil yog siv los ua electrodes thiab micro-bumps, uas yog ncaj qha soldered rau lub substrate. Tsis tshua muaj thermal tsis kam thiab siab conductivity ntawm tooj liab ua kom muaj kev sib kis tau zoo ntawm cov teeb liab thiab lub zog.
- Kev ntseeg tau thiab kev tswj xyuas cua sov: Vim nws txoj kev tiv thaiv zoo rau electromigration thiab mechanical zog, tooj liab muab kev ntseeg tau zoo dua rau lub sijhawm ntev nyob rau hauv kev sib txawv ntawm thermal cycles thiab tam sim no ntom. Tsis tas li ntawd, tooj liab lub siab thermal conductivity pab sai sai dissipate tshav kub generated thaum lub sij hawm nti ua hauj lwm mus rau lub substrate los yog kub dab dej, txhim khu lub thermal tswj lub peev xwm ntawm lub pob.
- Lead Frame Khoom: tooj liab ntawv ciyog dav siv nyob rau hauv txhuas ncej ntim, tshwj xeeb tshaj yog rau lub hwj chim ntaus ntawv ntim. Cov ncej txhuas muab cov qauv kev txhawb nqa thiab kev sib txuas hluav taws xob rau cov nti, xav tau cov khoom siv nrog cov khoom siv hluav taws xob siab thiab zoo thermal conductivity. Copper foil ua tau raws li cov cai no, txo cov nqi ntim khoom zoo thaum txhim kho thermal dissipation thiab hluav taws xob ua haujlwm.
- Cov txheej txheem kho deg: Hauv cov ntawv thov siv tau, cov ntawv ci tooj liab feem ntau ua rau kev kho saum npoo xws li npib tsib xee, tin, lossis nyiaj plating los tiv thaiv oxidation thiab txhim kho cov khoom siv. Cov kev kho mob no ntxiv txhim khu kev ruaj khov thiab kev ntseeg siab ntawm cov ntawv ci tooj liab hauv cov khoom siv lead ua.
- Conductive Material nyob rau hauv Multi-Chip Modules: System-in-package technology integrates ntau cov chips thiab passive Cheebtsam rau hauv ib pob kom ua tiav kev sib koom ua ke ntau dua thiab ua haujlwm ceev. Copper foil yog siv los tsim cov kev sib txuas hauv hluav taws xob thiab ua haujlwm raws li txoj hauv kev tam sim no. Daim ntawv thov no yuav tsum muaj cov ntawv ci tooj liab kom muaj qhov ua tau zoo thiab cov yam ntxwv ultra-nyias kom ua tiav kev ua tau zoo dua hauv qhov chaw ntim tsawg.
- RF thiab millimeter-Wave Applications: Copper foil kuj tseem ua lub luag haujlwm tseem ceeb hauv high-frequency signal transmission circuits in SiP, tshwj xeeb tshaj yog nyob rau hauv xov tooj cua zaus (RF) thiab millimeter-yoj daim ntawv thov. Nws cov yam ntxwv poob qis thiab zoo heev conductivity tso cai rau nws txo cov teeb liab attenuation zoo thiab txhim kho kev sib kis tau zoo nyob rau hauv cov kev siv high-frequency.
- Siv nyob rau hauv Cov Txheej Txheem Ntxiv (RDL): Hauv kev ntim cov kiv cua, cov ntawv ci tooj liab yog siv los tsim cov txheej txheem rov ua dua tshiab, ib qho kev siv tshuab uas rov faib cov nti I/O mus rau thaj chaw loj dua. Lub siab conductivity thiab zoo adhesion ntawm tooj liab ntawv ci ua rau nws yog ib qho zoo tagnrho cov ntaub ntawv rau lub tsev redistribution khaubncaws sab nraud povtseg, ua rau I / O ceev thiab txhawb multi-chip kev koom ua ke.
- Txo qhov loj me thiab teeb liab kev ncaj ncees: Daim ntawv thov ntawm cov ntawv ci tooj liab hauv cov txheej txheej rov ua dua tshiab pab txo cov pob loj thaum txhim kho cov teeb liab kev sib raug zoo thiab kev nrawm, uas yog qhov tseem ceeb tshwj xeeb hauv cov khoom siv txawb thiab cov kev ua haujlwm siab uas xav tau cov ntim me me thiab kev ua haujlwm siab dua.
- Copper Foil Heat Sinks thiab Thermal Channels: Vim nws cov thermal conductivity zoo heev, cov ntawv ci tooj liab feem ntau yog siv rau hauv cov dab dej kub, thermal channels, thiab thermal interface cov ntaub ntawv nyob rau hauv cov ntim ntim los pab hloov cov cua sov los ntawm cov nti mus rau sab nraud cua txias. Daim ntawv thov no yog ib qho tseem ceeb tshwj xeeb tshaj yog nyob rau hauv high-power chips thiab tej pob khoom uas yuav tsum tau tswj qhov kub thiab txias, xws li CPUs, GPUs, thiab hwj chim tswj chips.
- Siv nyob rau hauv Through-Silicon Via (TSV) Technology: Nyob rau hauv 2.5D thiab 3D nti ntim technologies, tooj liab ntawv ci yog siv los tsim conductive sau cov ntaub ntawv rau los ntawm-silicon vias, muab ntsug interconnection ntawm chips. Kev ua haujlwm siab thiab kev ua tiav ntawm cov ntawv ci tooj liab ua rau nws nyiam cov khoom siv hauv cov txheej txheem ntim qib siab no, txhawb kev sib koom ua ke ntau dua thiab cov teeb liab luv dua, yog li txhim kho kev ua haujlwm tag nrho.
2. Flip-Chip Ntim
3. Lead Frame Ntim
4. System-in-Package (SiP)
5. Ntxuam tawm ntim
6. Thermal Management thiab Heat Dissipation Applications
7. Advanced Packaging Technologies (xws li 2.5D thiab 3D Ntim)
Zuag qhia tag nrho, daim ntawv thov ntawm cov ntawv ci tooj liab hauv cov ntim ntim tsis txwv rau cov kev sib txuas ib txwm siv thiab kev tswj xyuas thermal tab sis txuas mus rau cov khoom ntim khoom tshiab xws li flip-chip, system-in-package, fan-out packaging, thiab 3D ntim. Cov khoom siv ntau yam thiab kev ua tau zoo ntawm cov ntawv ci tooj liab ua lub luag haujlwm tseem ceeb hauv kev txhim kho kev ntseeg siab, kev ua tau zoo, thiab tus nqi-zoo ntawm cov ntim ntim.
Post lub sij hawm: Sep-20-2024